Job Overview
Location
San Francisco
Job Type
Full-time
Category
Engineering
Date Posted
May 8, 2026
Full Job Description
đź“‹ Description
- • Lead multi-physics modeling and simulation for next-generation advanced packaging systems to enable high-performance AI/HPC solutions by co-optimizing thermal, mechanical, and electrical interactions across chip, package, and system levels.
- • Develop and validate electro-thermal-mechanical simulation methodologies for heterogeneous integration platforms including 2.5D/3D packaging, HBM integration, and chiplet architectures, while performing reliability assessments and root-cause analysis for failure mechanisms such as warpage, solder fatigue, and electromigration.
- • Collaborate with cross-functional engineering teams and external partners to predict and optimize package performance, correlate simulation results with hardware measurements, and improve modeling accuracy for design predictability.
- • Drive innovation in advanced packaging by developing new modeling methodologies, influencing product architecture decisions through simulation-driven insights, and gaining deep expertise in semiconductor technologies including power delivery, materials, cooling, and system-level integration.
🎯 Requirements
- • Strong experience in thermal and mechanical modeling for advanced packaging systems
- • Hands-on experience with finite element analysis (FEA) and multi-physics simulation tools such as ANSYS, COMSOL, Abaqus, Icepak, or equivalent
- • Solid understanding of electro-thermal interactions and temperature-dependent electrical behavior
- • Experience solving complex chip/package/system integration challenges using multi-physics simulation and first-principles engineering approaches
- • Knowledge of package reliability mechanisms including warpage, solder fatigue, underfill stress, electromigration (EM), and thermo-mechanical interactions
- • MS or PhD in Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or a related technical field
🏖️ Benefits
- • Opportunity to work on cutting-edge AI-native silicon and system-level solutions for advanced AI workloads
- • Collaboration with software and research partners to co-design hardware tightly integrated with AI models
- • Access to develop custom design tools and methodologies that accelerate innovation in hardware optimization for AI
- • Exposure to production-grade silicon development for OpenAI’s supercomputing infrastructure
- • Engagement in solving extremely challenging thermal, mechanical, and electrical problems in advanced AI/HPC packaging technology
- • Ability to influence real product architecture decisions through simulation-driven insights across chip, package, cooling, and system design
Skills & Technologies
Onsite
Degree Required
About OpenAI, Inc.
OpenAI is a San Francisco-based artificial intelligence research and deployment company founded in 2015. It develops large-scale AI models such as GPT, DALL-E, and Codex, providing cloud APIs and consumer applications like ChatGPT. Originally established as a non-profit, it later created a capped-profit subsidiary to attract capital while maintaining its mission to ensure artificial general intelligence benefits all of humanity.
Get more remote jobs like this
Subscribe to the weekly newsletter for similar remote roles and curated hiring updates.
Newsletter
Weekly remote jobs and featured talent.
No spam. Only curated remote roles and product updates. You can unsubscribe anytime.
Similar Opportunities
ARGENTINA
Full-time
Expires Jun 20, 2026
Python
Scala
AWS
+5 more
21 days ago