Job Overview
Location
Bristol
Job Type
Full-time
Category
Engineering
Date Posted
April 3, 2026
Full Job Description
đź“‹ Description
- • As a Senior Packaging Engineer at Olix USA Inc., you will play a critical role in enabling the company’s mission to deliver next-generation AI hardware through the Optical Tensor Processing Unit (OTPU), where your expertise in advanced semiconductor packaging directly impacts the performance, scalability, and manufacturability of cutting-edge ASICs that aim to overcome the infrastructure bottleneck in AI compute.
- • You will own the end-to-end package design flow for high-performance AI hardware, translating die-level requirements into robust, manufacturable package solutions that integrate seamlessly with substrates, PCBs, and system-level architectures, ensuring electrical, thermal, and mechanical integrity from concept through production readiness.
- • You will join a mission-driven engineering team at the forefront of redefining computing infrastructure for the AI era, collaborating closely with ASIC, mechanical, thermal, and systems engineers to co-optimize package and system performance while driving innovation in 2.5D and 3D heterogeneous integration.
- • In this role, you will deepen your expertise in advanced packaging technologies, lead cross-functional design reviews and simulations, and gain ownership of critical productisation activities — positioning you as a technical leader in enabling the next wave of AI acceleration hardware.
- • Lead package architecture definition for ASIC-to-substrate integration, including bump/pad mapping, substrate escape, interconnect strategy, floorplanning, and stack-up development for 2.5D and 3D heterogeneous integration approaches.
- • Own and execute the full package design flow from concept to release, including detailed layout design in Cadence Allegro X APD or equivalent, die placement, power/ground distribution, high-speed signal breakout, and physical integration constraint management.
- • Perform and own PI/SI simulation using tools such as Ansys SIwave or Cadence Sigrity to validate signal integrity, power delivery, and package performance, translating results into design optimisations and sign-off decisions.
- • Drive package technology selection based on performance, risk, manufacturability, cost, and scalability, ensuring alignment with electrical, thermal, mechanical, reliability, and DFM/DFX requirements.
- • Collaborate with substrate vendors, OSATs, foundries, and PCB teams to support co-design, validate manufacturability, and ensure seamless handoff of design data for fabrication and assembly.
- • Support prototype bring-up, qualification, and early production by leading DFM/DFX activities, participating in root cause analysis of packaging-related issues, and reviewing substrate and manufacturing documentation for technical completeness.
🎯 Requirements
- • 8+ years of hands-on experience in advanced semiconductor packaging for ASICs or high-performance products, with deep expertise in front-end package design and ASIC-to-substrate integration.
- • Proven experience leading 2.5D and/or 3D package architecture development, including multi-die integration, chiplet interfaces, and heterogeneous integration strategies.
- • Strong proficiency with package design tools such as Cadence Allegro X APD, Siemens Xpedition, or equivalent, including layout, library development, and workflow optimisation.
- • Demonstrated capability in PI/SI simulation using tools like Ansys SIwave, Cadence Sigrity, or equivalent, with experience validating power delivery and signal integrity at the package level.
- • Experience in substrate design and package-to-board integration, including collaboration with vendors and OSATs on stack-up definition, design rules, and manufacturing readiness.
- • Proven ability to work across multidisciplinary teams (ASIC, mechanical, thermal, systems) and external partners to align package decisions with broader product requirements.
🏖️ Benefits
- • Competitive salary of £109,000+ per year, commensurate with experience and skills.
- • Meaningful equity ownership through stock options, allowing you to share in the company’s long-term success.
- • £24,000 annual Living-Local Bonus for employees residing within 20 minutes of the Bristol office to reduce commute time and enhance work-life balance.
- • Comprehensive private healthcare via BUPA, including Medical History Disregarded (MHD) coverage for medical and dental care.
- • 25 days of annual leave plus all UK bank holidays, supporting rest and recovery.
- • Provision of elite hardware, including M4 Macs with optional M4 Pro upgrades, noise-cancelling headphones, and fully ergonomic workstations.
- • Access to an in-house high-performance 3D printing lab for prototyping, experimentation, and personal projects.
- • Chef-prepared meals available for late work sessions and a caffeine tab at a local coffee shop.
- • Full UK and international visa sponsorship, with dedicated relocation support for domestic and international moves.
Skills & Technologies
Senior
Onsite
About Olix USA Inc.
Olix USA Inc. is a San Diego-based biotechnology company that develops RNA interference therapeutics for ocular and central nervous system diseases. Founded in 2010, the company leverages asymmetric siRNA technology to silence disease-causing genes in conditions such as glaucoma, age-related macular degeneration, and Huntington's disease. Its lead candidate, OLX10010, is in Phase 1 trials for glaucoma, while other programs target wet AMD and Huntington's disease. Olix partners with pharmaceutical companies to advance its pipeline and maintain operations across the United States and South Korea.
Get more remote jobs like this
Subscribe to the weekly newsletter for similar remote roles and curated hiring updates.
Newsletter
Weekly remote jobs and featured talent.
No spam. Only curated remote roles and product updates. You can unsubscribe anytime.
Similar Opportunities
ARGENTINA
Full-time
Expires Jun 20, 2026
Python
Scala
AWS
+5 more
3 days ago