Package, Assembly, Test (PAT) Team Lead

📋 Description

• • Lyte, Inc. is at the forefront of developing cutting-edge perception systems for Physical AI, designed to operate seamlessly in complex and dynamic environments. Our innovative platform integrates custom silicon, advanced sensors, and sophisticated software, driving the next generation of robotics, mobility, and automation. Headquartered in Sunnyvale, California, with a growing global footprint, Lyte is seeking a highly experienced and motivated Package, Assembly, Test (PAT) Team Lead to spearhead our operations in Asia. If you are passionate about building impactful technology and thrive in a fast-paced, hands-on engineering setting, this is an exceptional opportunity to make a significant contribution.
• • This pivotal role requires a seasoned engineering leader with a strong background in device packaging, module mechanical assembly, PCBA, and device test engineering. The ideal candidate will possess a degree in Electrical Engineering, Photonics, Mechanical Engineering, or a closely related technical field, coupled with a proven track record of leading teams and managing complex manufacturing processes.
• • As the PAT Team Lead, you will be instrumental in overseeing and expanding Lyte's Asia operations. Your responsibilities will encompass managing relationships with Outsourced Semiconductor Assembly and Test (OSAT) providers, assembly houses, and Printed Circuit Board Assembly (PCBA) lines. You will play a critical role in supporting both New Product Introduction (NPI) and high-volume production, ensuring the highest standards of quality and efficiency.
• • A key aspect of your role will involve close collaboration with our Headquarters (HQ) R&D and Operations teams. You will be responsible for implementing wafer-level probe tests at OSAT facilities to meticulously identify known good dies, a crucial step in optimizing yield and performance. Furthermore, you will work hand-in-hand with the HQ team to drive continuous improvement in device packaging processes, focusing on increasing process capability (Cp) and process capability index (Cpk).
• • Your expertise will extend to supporting wafer-level processes, bar-level processes, and Chip-on-Chip (CoC) processes with our III-V foundries. This includes overseeing CoC-level testing and qualification, both before and after burn-in, to guarantee the reliability and robustness of our components. You will also be tasked with supporting module assembly and PCBA for NPI and volume production in collaboration with our HQ teams and assembly partners.
• • In partnership with our reliability engineering team, you will implement and oversee a comprehensive suite of reliability tests for wafers, unpackaged devices, packaged devices, and complete systems. This rigorous testing regimen is essential for validating the long-term performance and durability of Lyte's products.
• • Effective communication and documentation are paramount. You will be responsible for authoring detailed technical documentation for test implementation, generating comprehensive reports, and presenting findings to both internal stakeholders and external partners. Your ability to make timely and sound technical and project decisions will be critical to the success of the PAT team.
• • You will actively participate in Failure Mode and Effects Analysis (FMEA) and Failure Analysis (FA) processes, driving contract manufacturers to provide thorough 8D reports to address any issues identified. As the team grows, you will be responsible for managing and expanding the Asia operation team, fostering a high-performance culture and ensuring the development of your team members.
• • This role demands a proactive, detail-oriented individual with a strong sense of ownership and a commitment to excellence. You will be a key player in ensuring the successful transition of our advanced technologies from R&D to mass production, contributing directly to Lyte's mission of enabling Physical AI.