Advanced Packaging & Power Delivery Senior Engineer

Axelera AI B.V.

Job Overview

Location

Hybrid/Remote - Europe (incl. UK)

Job Type

Full-time

Full Job Description

📋 Description

• As a Senior Advanced Packaging & Power Delivery Engineer at Axelera AI, you will play a pivotal role in shaping the silicon and packaging architecture of next-generation AI accelerators, owning power-delivery design from on-die power grids to package and PCB PDN, and driving innovation in advanced packaging technologies to scale from current products to future multi-chiplet, 3D-integrated systems.
• You will own end-to-end power-delivery design, lead advanced packaging architecture decisions for 2.5D/3D stacking and multi-chiplet integration, perform SI/PI verification and sign-off, collaborate with Silicon Engineering and AI Integrated Systems teams, support thermal and integration reviews, develop power-delivery methodology and design guidelines, identify and mitigate SI/PI risks, mentor team members, and engage with external partners such as OSAT houses and substrate vendors to co-develop advanced packaging solutions.
• You will work within Axelera AI’s R&D Custom Design team, collaborating closely with Silicon Engineering and AI Integrated Systems, at the intersection of analog design, packaging innovation, and product delivery, with real ownership and direct impact on the chips shipped, in a fast-growing, international deep-tech organization headquartered at the High Tech Campus in Eindhoven with offices across Europe.
• You will deepen your expertise in advanced packaging and power integrity for AI accelerators, gain end-to-end ownership of PDN design across die, package, and PCB levels, influence architectural decisions for next-gen chiplet-based systems, and grow as a technical leader by mentoring peers and shaping methodology in a high-impact R&D environment.

🎯 Requirements

• Bachelor’s or Master’s degree in Electrical Engineering, Microelectronics, or a related field; PhD is a plus.
• 7+ years of experience in power delivery and/or advanced packaging design in a semiconductor or deep-tech environment.
• Demonstrated expertise in on-die power grid design and package/PCB PDN analysis.
• Hands-on experience with 2.5D and/or 3D IC packaging technologies, multi-chiplet integration, and interposer/substrate co-design.
• Proficiency with industry-standard EDA tools for power integrity, PDN simulation, and package design.
• Ability to work cross-functionally and communicate complex technical trade-offs to diverse stakeholder groups.

🏖️ Benefits

• Attractive compensation package including a pension plan, extensive employee insurances, and the option to get company shares.
• Open culture supporting creativity and continual innovation with collaborative ownership and freedom with responsibility.
• Flexible working arrangement: option to work from Axelera AI offices in Belgium, Netherlands, Switzerland, Italy, or UK, or fully remotely from any European country (incl. UK), with relocation support to Italy or the Netherlands.
• Opportunity to work in a diverse, inclusive, and equal-opportunity environment that celebrates every team member’s background.
• Chance to shape and be part of a dynamic, fast-growing, international organization with visibility into a strong business pipeline exceeding $100 million.

Skills & Technologies

Node.js

Senior

Remote

Degree Required

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Axelera AI B.V.

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About Axelera AI B.V.

Axelera AI B.V. is a Dutch semiconductor company that designs and markets purpose-built, energy-efficient AI inference accelerators. Its products combine a custom RISC-V architecture with in-memory computing to deliver high performance for computer-vision workloads at the edge. Headquartered in Eindhoven with offices in Belgium, Switzerland, Italy and the UK, the company serves OEMs and system integrators in security, retail, robotics and automotive markets.

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