Job Overview
Location
San Francisco
Job Type
Full-time
Category
Engineering
Date Posted
June 19, 2026
Full Job Description
đź“‹ Description
- • Lead reliability engineering for advanced semiconductor packages used in high-performance AI and computing systems, ensuring robustness and longevity of critical hardware infrastructure.
- • Assess package-level mechanical and thermal reliability risks, develop test plans, perform root-cause analysis, and recommend corrective actions across design, materials, and manufacturing.
- • Collaborate with package design, silicon design, system engineering, manufacturing, and ASIC partners to predict behavior, optimize designs, and improve package reliability from early architecture through high-volume production.
- • Develop and apply thermo-mechanical modeling, lifetime prediction methodologies, and reliability models to enhance power integrity, thermal performance, mechanical robustness, and platform scalability.
- • Influence product architecture and design decisions through simulation-driven insights across chip, package, cooling, and system levels, pushing the limits of heterogeneous integration and advanced cooling for AI workloads.
🎯 Requirements
- • 8+ years of industry experience in semiconductor package reliability principles and failure mechanisms, including electromigration, solder-joint fatigue, interfacial delamination, dielectric cracking, via failure, warpage, creep, stress relaxation, and material degradation.
- • In-depth knowledge of advanced packaging architectures such as 2.5D and 3.5D integration, interposers, embedded bridges, chiplets, large package substrates, HBM integration, redistribution layers, and package-level power delivery.
- • Demonstrated experience leading package failure investigations, performing root-cause analysis, and implementing effective design, material, process, or manufacturing corrective actions.
- • Strong experience with thermal and mechanical finite-element modeling of packages, including temperature distribution, warpage, stress, strain, fatigue, and interfacial reliability.
- • Strong understanding of package-material behavior, including coefficient of thermal expansion, elasticity, viscoelasticity, plasticity, creep, adhesion, fracture toughness, thermal conductivity, and temperature-dependent properties.
🏖️ Benefits
- • Opportunity to work on cutting-edge AI-native silicon and system-level solutions at OpenAI, contributing to next-generation supercomputing infrastructure for AI workloads.
- • Collaborate closely with software and research partners to co-design hardware tightly integrated with AI models, enabling innovation at the intersection of hardware and artificial intelligence.
- • Develop custom design tools and methodologies that accelerate innovation and enable hardware optimized specifically for AI, advancing the state of the art in semiconductor packaging.
- • Access to a mission-driven culture focused on ensuring artificial intelligence benefits all of humanity, with a strong commitment to safety, inclusivity, and equal opportunity.
- • Comprehensive support for professional growth, including reasonable accommodations for applicants with disabilities and adherence to fair chance hiring practices in compliance with local and state laws.
Skills & Technologies
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About OpenAI, Inc.
OpenAI is a San Francisco-based artificial intelligence research and deployment company founded in 2015. It develops large-scale AI models such as GPT, DALL-E, and Codex, providing cloud APIs and consumer applications like ChatGPT. Originally established as a non-profit, it later created a capped-profit subsidiary to attract capital while maintaining its mission to ensure artificial general intelligence benefits all of humanity.
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