Staff Optical Engineer – Optical Interconnect & Optical Communications

📋 Description

• • Join OLIX, a pioneering company at the forefront of revolutionizing AI infrastructure by developing the next generation of computing paradigms. We are tackling the monumental challenge of the AI explosion, which has outpaced traditional hardware capabilities, by creating the Optical Tensor Processing Unit (OTPU). This groundbreaking technology promises unprecedented performance and energy efficiency, addressing the critical infrastructure gap and positioning OLIX to be a dominant force in the coming decade.
• • As a Staff Optical Engineer – Optical Interconnect & Optical Communications, you will play a pivotal role in designing and delivering scalable, high-bandwidth optical interconnect systems essential for AI data centers. Your expertise will be instrumental in shaping the future of chip-to-chip, inter-tray, intra-tray, and rack-to-rack optical links.
• • This is a unique opportunity to operate at the nexus of optics, ASICs, high-speed electronics, advanced packaging, and sophisticated algorithms. You will be immersed in tightly integrated electro-optic systems meticulously optimized for maximum bandwidth density, ultra-low latency, superior power efficiency, robust thermal performance, unwavering reliability, and high-volume manufacturability.
• • We are seeking an optical engineer who possesses a rare blend of theoretical depth and practical hands-on capability. You should be as comfortable discussing intricate link budgets and complex Maxwell’s equations as you are with the physical alignment of fiber arrays. The ideal candidate will fluidly transition between detailed simulation, rigorous lab validation, and a pragmatic understanding of manufacturing constraints.
• • This role is for a builder and a problem-solver who thrives on tackling real-world implementation challenges, rather than solely focusing on theoretical designs. You will be a technical leader, deeply engaged with the granular details of the systems you help create.
• • OLIX is rapidly expanding its world-class optical systems team, and this position offers significant opportunities for growth and impact.
• • Key Responsibilities:
• • Optical Interconnect & CPO Architecture Definition:
• • Architect and define high-bandwidth optical interconnect systems, encompassing critical link types: 1. In-tray (chip-to-chip), 2. Intra-tray, and 3. Rack-to-rack.
• • Actively contribute to the development of co-packaged optics (CPO) architectures, focusing on the intimate integration of photonics with high-performance ASICs to achieve optimized latency and connectivity.
• • Develop and implement scalable link strategies leveraging a variety of media, including advanced fiber optics, integrated waveguides, and planar-light-wave circuits (PLC).
• • Take ownership of comprehensive system-level link budgets, meticulously analyzing and defining requirements for insertion loss, coupling loss, bandwidth, Bit Error Rate (BER), power consumption, and thermal margins for both lasers and receivers.
• • Strategically balance competing constraints related to bandwidth density, power consumption, system reliability, and ease of serviceability.
• • Co-Design and System Optimization:
• • Foster close collaboration with cross-functional teams, including opto-mechanical, ASIC, mixed-signal, RF, and DSP engineers, to define precise electro-optic interface specifications.
• • Actively participate in the co-optimization of critical system parameters such as modulation formats, equalization strategies, laser integration approaches, and driver and receiver architectures.
• • Contribute significantly to comprehensive system modeling efforts that span high-speed VCSELs, optical components, detectors, electrical channels, advanced packaging, and signal processing layers.
• • Conduct thorough analyses of trade-offs between optical reach, power budget limitations, and the complexity of electronic solutions.
• • Demonstrate familiarity with state-of-the-art rapid optical prototyping tools, with a particular emphasis on their application to PLCs and micro-optics.
• • Fiber, Waveguides & PLC System Design:
• • Design and optimize high-density fiber-optic interconnect solutions tailored for demanding AI data center environments.
• • Develop and rigorously analyze integrated waveguide-based optical links, focusing on performance and scalability.
• • Design Planar Lightwave Circuits (PLC) for efficient optical routing, splitting, tapping, multiplexing, in/out coupling, and complex signal distribution networks.
• • Optimize fiber-to-waveguide and fiber-to-package coupling strategies for both multimode and single-mode waveguide interfaces.
• • Proactively address and resolve packaging constraints, including critical alignment tolerances and the selection and implementation of appropriate connector strategies.
• • CPO Packaging, Thermal & Reliability Considerations:
• • Contribute to the strategic development of on-package and near-package photonic integration solutions.
• • Evaluate and mitigate thermal interactions between high-power ASICs and sensitive photonic devices.
• • Address crucial trade-offs related to serviceability, repairability, and field-replaceability within CPO architectures.
• • Lead and execute tolerance and reliability analyses for high-density optical packaging designs.
• • Collaborate effectively with mechanical and thermal engineering teams to ensure robust and integrated system performance.
• • High-Speed Validation & Production Readiness:
• • Define comprehensive validation strategies for Terabits per second (Tbps)-class optical links, supporting various multiplexing schemes (spatial, wavelength, modulation).
• • Conduct detailed analysis of key performance metrics including insertion loss, return loss, crosstalk, bandwidth, and noise performance.
• • Ensure strong correlation between system simulations and experimental results obtained from lab testing and pre-production units.
• • Drive the adoption of Design for Manufacturing (DFM) principles for co-packaged and high-density optical assemblies.
• • Provide essential support during pilot builds and production ramp-up phases, proactively resolving yield and variability issues.